I have a sample of two small and thin metal plates joining together with a solder. The solder material is most likely a lead-tin-bismuth alloy, which has a melting point close to the boiling point of water.
I have sectioned it for metallographic examination. However, the solder material was being scoop oput when I try to polish the mounted sample.
I wonder if it was because I was using a napped polishing cloth that remove the solder during polishing? Could any one helps? Thanks.
I have sectioned it for metallographic examination. However, the solder material was being scoop oput when I try to polish the mounted sample.
I wonder if it was because I was using a napped polishing cloth that remove the solder during polishing? Could any one helps? Thanks.
